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cy7c1011cv33 automotive 2-mbit (128 k 16) static ram cypress semiconductor corporation ? 198 champion court ? san jose , ca 95134-1709 ? 408-943-2600 document number: 001-86374 rev. *b revised july 24, 2013 2-mbit (128 k 16) static ram features temperature ranges ? automotive-e: ?40 c to 125 c high speed ? t aa = 10 ns low active power ? 468 mw (max) 2.0 v data retention automatic power down when deselected independent control of upper and lower bits easy memory expansion with chip enable (ce) and output enable (oe ) features available in pb-free 48-ball grid array (bga) package functional description the cy7c1011cv33 automotive is a high performance complementary metal oxide semiconductor (cmos) static ram organized as 131,072 words by 16 bits. this device has an automatic power down feature that significantly reduces power consumption when deselected. to write to the device, take ce and write enable (we ) inputs low. if byte low enable (ble ) is low, then data from i/o pins (i/o 0 through i/o 7 ), is written into the location specified on the address pins (a 0 through a 16 ). if byte high enable (bhe ) is low, then data from i/o pins (i/o 8 through i/o 15 ) is written into the location specified on the address pins (a 0 through a 16 ). to read from the device, take ce and oe low while forcing the write enable (we ) high. if ble is low, then data from the memory location specified by the address pins appear on i/o 0 to i/o 7 . if byte high enable (bhe ) is low, then data from memory appears on i/o 8 to i/o 15 . for more information, see the truth table on page 10 for a complete description of read and write modes. the input and output pins (i/o 0 through i/o 15 ) are placed in a high impedance state when the device is deselected (ce high), the outputs are disabled (oe high), the bhe and ble are disabled (bhe , ble high), or during a write operation (ce low and we low). 128 k x 16 ram array i/o 0 ?i/o 7 row decoder a 0 a 1 a 2 a 3 a 6 column decoder a 10 a 11 a 12 a 13 a 14 sense amps input buffer oe a 4 a 5 i/o 8 ?i/o 15 we ble bhe a 15 a 8 a 7 a 16 ce a 9 logic block diagram
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 2 of 15 contents pin configuration ............................................................. 3 selection guide ................................................................ 3 maximum ratings ............................................................. 4 operating range ............................................................... 4 electrical characteristics ................................................. 4 capacitance ...................................................................... 5 thermal resistance .......................................................... 5 ac test loads and waveforms ....................................... 5 switching characteristics ................................................ 6 switching waveforms ...................................................... 7 truth table ...................................................................... 10 ordering information ...................................................... 11 ordering code definitions ......................................... 11 package diagrams .......................................................... 12 acronyms ........................................................................ 13 document conventions ................................................. 13 units of measure ....................................................... 13 document history page ................................................. 14 sales, solutions, and legal information ...................... 15 worldwide sales and design s upport ......... .............. 15 products .................................................................... 15 psoc? solutions ...................................................... 15 cypress developer community ................................. 15 technical support ................. .................................... 15
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 3 of 15 pin configuration figure 1. 48 ball bga pinout [1] ble _____ oe a 0 a 1 a 2 nc i/o 8 bhe a 3 a 4 ce i/o 0 i/o 9 i/o 10 a 5 a 6 i/o 1 i/o 2 v ss i/o 11 nc a 7 i/o 3 v cc v cc i/o 12 nc a 16 i/o 4 vss i/o 14 i/o 13 a 14 a 15 i/o 5 i/o 6 i/o 15 nc a 12 a 13 we i/o 7 nc a 8 a 9 a 10 a 11 nc _____ 1 2 3 4 5 6 a b c d e f g h _____ _____ _____ selection guide description -10 unit maximum access time 10 ns maximum operating current automotive-e 130 ma maximum cmos standby current automotive-e 15 ma note 1. nc pins are not connected on the die.
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 4 of 15 maximum ratings exceeding maximum ratings may shorten the useful life of the device. these user guidelines are not tested. storage temperature ..... ............ ............... ?65 ? c to +150 ? c ambient temperature with power applied .... .............. .............. .......... ?55 ? c to +125 ? c supply voltage on v cc relative to gnd [2] .........................................?0.5 v to +4.6 v dc voltage applied to outputs in high z state [2] ................................. ?0.5 v to v cc + 0.5 v dc input voltage [2] .............................. ?0.5 v to v cc + 0.5 v current into outputs (low) ........................................ 20 ma static discharge voltage (mil-std-883, method 3015) ................................. > 2001 v latch up current ..................................................... > 200 ma operating range range ambient temperature (t a ) v cc automotive-e ?40 ? c to +125 ? c 3.3 v ? 10% electrical characteristics over the operating range parameter description test conditions -10 unit min max v oh output high voltage v cc = min, i oh = ?4.0 ma 2.4 ? v v ol output low voltage v cc = min, i ol = 8.0 ma ? 0.4 v v ih input high voltage 2.0 v cc + 0.3 v v il input low voltage [2] ?0.3 0.8 v i ix input leakage current gnd < v i < v cc automotive-e ?20 +20 ? a i oz output leakage current gnd < v i < v cc , output disabled automotive-e ?20 +20 ? a i cc v cc operating supply current v cc = max, i out = 0 ma, f = f max = 1/t rc automotive-e 130 ma i sb1 automatic ce power down current ? ttl inputs max v cc , ce > v ih , v in > v ih or v in < v il , f = f max automotive-e 45 ma i sb2 automatic ce power down current ? cmos inputs max v cc , ce > v cc ? 0.3 v, v in > v cc ? 0.3 v, or v in < 0.3 v, f = 0 automotive-e 15 ma note 2. v il (min) = ?2.0 v for pulse durations of less than 20 ns.
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 5 of 15 capacitance parameter [3] description test conditions max unit c in input capacitance t a = 25 ? c, f = 1 mhz, v cc = 3.3 v 8 pf c out output capacitance 8pf thermal resistance parameter [3] description test conditions 48-pin bga unit ? ja thermal resistance (junction to ambient) still air, soldered on a 3 4.5 inch, four-layer printed circuit board 38.15 ? c/w ? jc thermal resistance (junction to case) 9.15 ? c/w ac test loads and waveforms figure 2. ac test loads and waveforms [4] 90% 10% 3.0 v gnd 90% 10% all input pulses 3.3 v output 30 pf* * capacitive load consists of all components of the test environment (b) r 317 ?? r2 351 ?? rise time: 1 v/ns fall time: 1 v/ns 30 pf* output z = 50 ? 50 ? 1.5 v (b) (a) 3.3 v output 5 pf (c) r 317 ?? r2 351 ?? 10-ns devices: 12-ns devices: high-z characteristics: notes 3. tested initially and after any design or proce ss changes that may affect these parameters. 4. ac characteristics (except high z) for 10-ns part s are tested using the load conditions shown in figure 2 (a). high z characteristics are tested for all speeds using the test load shown in figure 2 (b).
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 6 of 15 switching characteristics over the operating range parameter [5] description -10 unit min max read cycle t power [6] v cc (typical) to the first access 1 ? ? s t rc read cycle time 10 ? ns t aa address to data valid ? 10 ns t oha data hold from address change 3 ? ns t ace ce low to data valid ? 10 ns t doe oe low to data valid ? 6 ns t lzoe oe low to low z [7] 0? ns t hzoe oe high to high z [7, 8] ?5 ns t lzce ce low to low z [7] 3? ns t hzce ce high to high z [7, 8] ?5 ns t pu ce low to power up 0 ? ns t pd ce high to power down ? 10 ns t dbe byte enable to data valid ? 6 ns t lzbe byte enable to low z 0 ? ns t hzbe byte disable to high z ? 6 ns write cycle [9, 10] t wc write cycle time 10 ? ns t sce ce low to write end 7 ? ns t aw address setup to write end 7 ? ns t ha address hold from write end 0 ? ns t sa address setup to write start 0 ? ns t pwe we pulse width 7? ns t sd data setup to write end 5 ? ns t hd data hold from write end 0 ? ns t lzwe we high to low z [7] 3? ns t hzwe we low to high z [7, 8] ?5 ns t bw byte enable to end of write 7 ? ns notes 5. test conditions assume signal transition ti me of 3 ns or less, timing reference levels of 1.5 v, and input pulse levels of 0 to 3.0 v. 6. t power gives the minimum amount of time that the power supply is at typical v cc values until the first memory access is performed. 7. at any temperature and voltage condition, t hzce is less than t lzce , t hzoe is less than t lzoe , and t hzwe is less than t lzwe for any device. 8. t hzoe , t hzbe , t hzce , and t hzwe are specified with a load capacitance of 5 pf as in part (c) of figure 2 on page 5 . transition is measured ? 500 mv from steady state voltage. 9. the internal write time of the memory is defined by the overlap of ce low, we low, and bhe /ble low. ce , we , and bhe /ble must be low to initiate a write. the transition of these signals terminate the write. the input data setup and hold timing is referenced to the leading edge of the signal that terminates the write. 10. the minimum write cycle time for write cycle no. 3 (we controlled, oe low) is the sum of t hzwe and t sd .
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 7 of 15 switching waveforms figure 3. read cycle no. 1 (address transition controlled) [11, 12] figure 4. read cycle no. 2 (oe controlled) [12, 13] previous data valid data valid rc t aa t oha t rc address data out 50% 50% data valid t rc t ace t doe t lzoe t lzce t pu high impedance t hzoe t hzbe t pd t dbe t lzbe t hzce high impedance i cc i sb oe ce address data out v cc supply bhe ,ble current notes 11. device is continuously selected. oe , ce , bhe , and/or ble = v il . 12. we is high for read cycle. 13. address valid prior to or coincident with ce transition low.
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 8 of 15 figure 5. write cycle no. 1 (ce controlled) [14, 15] figure 6. write cycle no. 2 (ble or bhe controlled) switching waveforms (continued) t hd t sd t sce t sa t ha t aw t pwe t wc bw t data io address ce we bhe ,ble t hd t sd t bw t sa t ha t aw t pwe t wc t sce data i/o address bhe ,ble ce we notes 14. data i/o is high impedance if oe, bhe , and/or ble = v ih . 15. if ce goes high simultaneously with we going high, the output remains in a high impedance state.
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 9 of 15 figure 7. write cycle no. 3 (we controlled, low) switching waveforms (continued) t hd t sd t sce t ha t aw t pwe t wc t bw t sa t lzwe t hzwe data i/o address ce we bhe ,ble
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 10 of 15 truth table ce oe we ble bhe i/o 0 ?i/o 7 i/o 8 ?i/o 15 mode power h x x x x high z high z power down standby (i sb ) l l h l l data out data out read ? all bits active (i cc ) l l h l h data out high z read ? lower bits only active (i cc ) l l h h l high z data out read ? upper bits only active (i cc ) l x l l l data in data in write ? all bits active (i cc ) l x l l h data in high z write ? lower bits only active (i cc ) l x l h l high z data in write ? upper bits only active (i cc ) l h h x x high z high z selected, outputs disabled active (i cc )
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 11 of 15 ordering code definitions ordering information speed (ns) ordering code package diagram package type operating range 10 CY7C1011CV33-10BAJXE 001-85259 48-ball bga (pb-free) automotive-e temperature range: e = automotive-e pb-free j = jedec package type: ba = 48-ball bga speed grade: 10 ns v33 = 3.3 v process technology: c = 150 nm bus width: 1 = 16 bits density: 01 = 2-mbit family code: 1 = fast asynchronous sram family technology code: c = cmos marketing code: 7 = sram company id: cy = cypress 7 cy 1 - ba 10 e c v33 x 1 01 c j
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 12 of 15 package diagrams figure 8. 48-ball fbga (6 8 1.2 mm) ba48m/bk48m (0 .35 mm ball diameter) package outline, 001-85259 001-85259 *a
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 13 of 15 acronyms document conventions units of measure acronym description bhe byte high enable ble byte low enable cmos complementary metal oxide semiconductor ce chip enable i/o input/output oe output enable sram static random access memory tqfp thin quad flat pack tsop thin small outline package ttl transistor-transistor logic vfbga very fine-pitch ball grid array we write enable symbol unit of measure c degree celsius mhz megahertz a microampere s microsecond ma milliampere mm millimeter ms millisecond mv millivolt mw milliwatt ns nanosecond % percent pf picofarad vvolt wwatt
cy7c1011cv33 automotive document number: 001-86374 rev. *b page 14 of 15 document history page document title: cy7c1011cv33 automotive, 2-mbit (128 k 16) static ram document number: 001-86374 revision ecn orig. of change submission date description of change ** 3924592 tava 03/12/2013 new data sheet. *a 4055409 memj 07/10/2013 changed stat us from preliminary to final. updated package diagrams : spec 001-85259 ? changed revision from ** to *a. updated in new template. *b 4075559 memj 07/24/2013 updated ordering information : no change in part numbers. changed package diagram spec number from ?51-85087? to ?001-85259? in ?package diagram? column.
document number: 001-86374 rev. *b revised july 24, 2013 page 15 of 15 all products and company names mentioned in this document may be the trademarks of their respective holders. cy7c1011cv33 automotive ? cypress semiconductor corporation, 2013. the information contained herein is subject to change without notice. cypress semico nductor corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a cypress product. nor does it convey or imply any license under patent or other rig hts. cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with cypres s. furthermore, cypress does not authorize its products for use as critical components in life-support systems where a ma lfunction or failure may reasonably be expe cted to result in significant injury to the user. the inclusion of cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies cypress against all charges. any source code (software and/or firmware) is owned by cypress semiconductor corporation (cypress) and is protected by and subj ect to worldwide patent protection (united states and foreign), united states copyright laws and internatio nal treaty provisions. cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the cypress source code and derivative works for the sole purpose of creating custom software and or firmware in su pport of licensee product to be used only in conjunction with a cypress integrated circuit as specified in the applicable agreement. any reproduction, modification, translation, compilation, or repre sentation of this source code except as specified above is prohibited without the express written permission of cypress. disclaimer: cypress makes no warranty of any kind, express or implied, with regard to this material, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. cypress reserves the right to make changes without further notice to t he materials described herein. cypress does not assume any liability arising out of the application or use of any product or circuit described herein. cypress does not authori ze its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. the inclusion of cypress? prod uct in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies cypress against all charges. use may be limited by and subject to the applicable cypress software license agreement. sales, solutions, and legal information worldwide sales and design support cypress maintains a worldwide network of offices, solution center s, manufacturer?s representatives, and distributors. to find t he office closest to you, visit us at cypress locations . products automotive cypress.co m/go/automotive clocks & buffers cypress.com/go/clocks interface cypress. com/go/interface lighting & power control cypress.com/go/powerpsoc cypress.com/go/plc memory cypress.com/go/memory psoc cypress.com/go/psoc touch sensing cyp ress.com/go/touch usb controllers cypress.com/go/usb wireless/rf cypress.com/go/wireless psoc ? solutions psoc.cypress.com/solutions psoc 1 | psoc 3 | psoc 4 | psoc 5lp cypress developer community community | forums | blogs | video | training technical support cypress.com/go/support

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